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Chapter 1: Introduction to Microvia and WLCSP Technologies. Chapter 2: Conventional Printed Circuit Board Technologies. Chapter 3: Microvias by Mechanical Drilling. Chapter 4: Microvias by Laser Drilling. Chapter 5: Microvias by Photoimaging. Chapter 6: Microvias by Etching. Chapter 7: Conductive Paste/Ink-Filled Microvias. Chapter 8: Special High-Density Interconnects for Flip Chip Applications. Chapter 9: Solders for Next-Generation High-Density Interconnects. Chapter 10: Solder-Bumped Flip-Chip WLCSP. Chapter 11: Assembly of Flip Chip on PCB/Substrate. Chapter 12: Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates.