Table of contents for Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

Bibliographic record and links to related information available from the Library of Congress catalog

Information from electronic data provided by the publisher. May be incomplete or contain other coding.

 Chapter 1: Introduction to Microvia and WLCSP Technologies.
 Chapter 2: Conventional Printed Circuit Board Technologies.
 Chapter 3: Microvias by Mechanical Drilling.
 Chapter 4: Microvias by Laser Drilling.
 Chapter 5: Microvias by Photoimaging.
 Chapter 6: Microvias by Etching.
 Chapter 7: Conductive Paste/Ink-Filled Microvias.
 Chapter 8: Special High-Density Interconnects for Flip Chip Applications.
 Chapter 9: Solders for Next-Generation High-Density Interconnects.
 Chapter 10: Solder-Bumped Flip-Chip WLCSP.
 Chapter 11: Assembly of Flip Chip on PCB/Substrate.
 Chapter 12: Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates.

Library of Congress subject headings for this publication: Microelectronic packaging, Integrated circuits Design and construction Cost control, Semiconductors Junctions, Printed circuits