Table of contents for Fundamentals of microsystems packaging / Rao R. Tummala, editor.

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 Chapter 1: Introduction to Microsystems Packaging.
 Chapter 2: The Role of Packaging in Microelectronics 
 Chapter 3: The Role of Packaging in Microsystems.
 Chapter 4: Fundamentals of Electrical Package Design.
 Chapter 5: Fundamentals of Design for Reliability.
 Chapter 6: Fundamentals of Thermal Management.
 Chapter 7: Fundamentals of Single Chip Packaging.
 Chapter 8: Funamentals of Multichip Packaging.
 Chapter 9: Fundamentals of IC Assembly.
 Chapter 10: Fundamentals of Water-Level Packaging.
 Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded.
 Chapter 12: Fundamentals of Optoelectronics.
 Chapter 13: Fundamentals of RF Packaging.
 Chapter 14: Fundamentals of Microelectromechanical Systems.
 Chapter 15: Fundamentals of Sealing and Encapsulation.
 Chapter 16: Fundamentals of System-Level PWB Technologies.
 Chapter 17: Fundamentals of Board Assembly.
 Chapter 18: Fundamentals of Packaging Materials and Processes.
 Chapter 19: Fundamentals of Electrical Testing.
 Chapter 20: Fundamentals of Package Manufacturing.
 Chapter 21: Fundamentals of Microsystems Design for the Environment.
 Chapter 22: Fundamentals of Microsstems Reliability.

Library of Congress subject headings for this publication: Electronic packaging Handbooks, manuals, etc, Microelectronic packaging Handbooks, manuals, etc, Miniature electronic equipment Packaging Handbooks, manuals, etc