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Contents Preface Chapter 1?Overview of MEMS and Microsystems 1.1 MEMS and Microsystem 1.2 Typical MEMS and Microsystems Products 1.3 Evolution of Microfabrication 1.4 Microsystems and Microelectronics 1.5 The Multidisciplinary Nature of Microsystems Design and Manufacture 1.6 Microsystems and Miniaturization 1.7 Application of Microsystems in Automotive Industry 1.8 Application of Microsystems in Other Industries 1.9 Markets for Microsystems Problems Chapter 2?Working Principles of Microsystems 2.1 Introduction 2.2 Microsensors 2.3 Microactuation 2.4 MEMS with Microactuators . 2.5 Microaccelerometers 2.6 Microfluidics Problems Chapter 3?Engineering Science for Microsystems Design and Fabrication 3.1 Introduction 3.2 Atomic Structure of Matters 3.3 Ions and Ionization 3.4 Molecular Theory of Matter and Inter-molecular Forces 3.5 Doping of Semiconductors 3.6 The Diffusion Process 3.7 Plasma Physics 3.8 Electrochemistry Problems Chapter 4?Engineering Mechanics for Microsystems Design 4.1 Introduction 4.2 Static Bending of Thin Plates 4.3 Mechanical Vibration 4.4 Thermomechanics 4.5 Fracture Mechanics 4.6 Thin Film Mechanics 4.7 Overview on Finite Element Stress Analysis Problems Chapter 5?Thermofluid Engineering and Microsystems Design 5.1 Introduction 5.2 Overview on the Basics of Fluid Mechanics in Macro and Mesoscales 5.3 Basic Equations in Continuum Fluid Dynamics 5.4 Laminar Fluid Flow in Circular Conduits 5.5 Computational Fluid Dynamics 5.6 Incompressible Fluid Flow in Microconduits 5.7 Overview on Heat Conduction in Solids 5.8 Heat Conduction in Multi-layered Thin Films 5.9 Heat Conduction in Solids in Submicrometer Scale Problems Chapter 6?Scaling Laws in Miniaturization 6.1 Introduction to Scaling 6.2 Scaling in Geometry 6.3 Scaling in Rigid-Body Dynamics 6.4 Scaling in Electrostatic Forces 6.5 Scaling of Electromagnetic Forces 6.6 Scaling in Electricity 6.7 Scaling in Fluid Mechanics 6.8 Scaling in Heat Transfer Problems Chapter 7?Materials for MEMS and Microsystems 7.1 Introduction 7.2 Substrates and Wafers 7.3 Active Substrate Materials 7.4 Silicon as a Substrate Material 7.5 Silicon Compounds 7.6 Silicon Piezoresistors 7.7 Gallium Arsenide 7.8 Quartz 7.9 Piezoelectric Crystals 7.10 Polymers 7.11 Packaging Materials Problems Chapter 8?Microsystems Fabrication Processes 8.1 Introduction 8.2 Photolithography 8.3 Ion Implantation 8.4 Diffusion 8.5 Oxidation 8.6 Chemical Vapor Deposition 8.7 Physical Vapor Deposition ? Sputtering 8.8 Deposition by Epitaxy 8.9 Etching 8.10 Summary of Microfabrication Problems Chapter 9?Overview of Micromanufacturing 9.1 Introduction 9.2 Bulk Micromanufacturing 9.3 Surface Micromachining 9.4 The LIGA Process 9.5 Summary on Micromanufacturing Problems Chapter 10?Microsystem Design 10.1 Introduction 10.2 Design Considerations 10.3 Process Design 10.4 Mechanical Design 10.5 Mechanical Design Using Finite Element Method 10.6 Design of Silicon Die of a Micropressure Sensor 10.7 Design of Microfluidics Network Systems 10.8 Computer-Aided Design Problems Chapter 11?Assembly, Packaging and Testing of Microsystems 11.1 Introduction 11.2 Overview of Microassembly 11.3 The High Costs of Microassembly 11.4 Microassembly Processes 11.5 Major Technical Problems in Microassembly 11.6 Microassembly Work Cells 11.7 Challenging Issues in Microassembly 11.8 Overview of Microsystems Packaging 11.9 General Considerations in Packaging Design 11.10 The Three Levels of Microsystems Packaging 11.11 Interfaces in Microsystems Packaging 11.12 Essential Packaging Technologies 11.13 Die preparation 11.14 Surface Bonding 11.15 Wire bonding: 11.16 Sealing and Encapsulation 11.17 Three-dimensional Packaging 11.18 Selection of Packaging Materials 11.19 Signal Mapping and Transduction 11.20 Design Case on Pressure Sensor Packaging 11.21 Reliability in MEMS Packaging 11.22 Testing for Reliability Problems Chapter 12?Introduction to Nanoscale Engineering 12.1 Introduction 12.2 Micro and Nanoscale Technologies 12.3 General Principle in Nanofabrication 12.4 Nanoproducts 12.5 Applications of Nanoproducts 12.6 Quantum Physics 12.7 Molecular Dynamics 12.8 Fluid Flow in Submicrometer and Nano Scales 12.9 Heat Conduction in Nanoscale 12.10 Measurement of Thermal Conductivity 12.11 Challenges in Nanoscale Engineering 12.12 Social Impacts of Nanoscale Engineering Problems Bibliography Index
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