Table of contents for Mems and microsystems : design, manufacture, and packaging / Tai-Ran Hsu.

Bibliographic record and links to related information available from the Library of Congress catalog.

Note: Contents data are machine generated based on pre-publication provided by the publisher. Contents may have variations from the printed book or be incomplete or contain other coding.


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Contents
Preface
Chapter 1?Overview of MEMS and Microsystems
 1.1	MEMS and Microsystem
1.2	 Typical MEMS and Microsystems Products
 1.3	Evolution of Microfabrication 
1.4 	Microsystems and Microelectronics
 1.5	The Multidisciplinary Nature of Microsystems Design and Manufacture
 1.6	Microsystems and Miniaturization
 1.7	Application of Microsystems in Automotive Industry
1.8	 Application of Microsystems in Other Industries
1.9	 Markets for Microsystems
 Problems
Chapter 2?Working Principles of Microsystems
2.1	 Introduction
2.2	 Microsensors
 2.3	Microactuation
 2.4	MEMS with Microactuators
. 	2.5	 Microaccelerometers
 2.6	Microfluidics
 Problems
Chapter 3?Engineering Science for Microsystems Design and Fabrication
 3.1 	Introduction
3.2	 	Atomic Structure of Matters
3.3	 Ions and Ionization
 3.4	Molecular Theory of Matter and Inter-molecular Forces
3.5	 Doping of Semiconductors
3.6	 The Diffusion Process
 3.7	Plasma Physics
 3.8	Electrochemistry
 Problems
 
Chapter 4?Engineering Mechanics for Microsystems Design
4.1	 Introduction
4.2	 Static Bending of Thin Plates
4.3	 Mechanical Vibration
4.4	 Thermomechanics
4.5	 Fracture Mechanics
4.6	 Thin Film Mechanics
4.7	 Overview on Finite Element Stress Analysis
Problems
Chapter 5?Thermofluid Engineering and Microsystems Design 
5.1	 Introduction
5.2	 Overview on the Basics of Fluid Mechanics in Macro and Mesoscales
5.3	 Basic Equations in Continuum Fluid Dynamics
5.4	 Laminar Fluid Flow in Circular Conduits
5.5	 Computational Fluid Dynamics
5.6	 Incompressible Fluid Flow in Microconduits
5.7	 Overview on Heat Conduction in Solids
5.8	 Heat Conduction in Multi-layered Thin Films
5.9	 Heat Conduction in Solids in Submicrometer Scale
Problems
Chapter 6?Scaling Laws in Miniaturization
 6.1	Introduction to Scaling
6.2	 Scaling in Geometry
 6.3 Scaling in Rigid-Body Dynamics
 6.4	Scaling in Electrostatic Forces
6.5	 Scaling of Electromagnetic Forces
 6.6	Scaling in Electricity
 6.7	Scaling in Fluid Mechanics
 6.8	Scaling in Heat Transfer
 Problems
Chapter 7?Materials for MEMS and Microsystems
7.1	 Introduction
7.2	 Substrates and Wafers
7.3	 Active Substrate Materials
7.4	 Silicon as a Substrate Material
7.5	 Silicon Compounds
7.6	 Silicon Piezoresistors
7.7	 Gallium Arsenide		
7.8	 Quartz
7.9	 Piezoelectric Crystals
7.10	 Polymers
7.11	 Packaging Materials
 Problems
Chapter 8?Microsystems Fabrication Processes
8.1	 Introduction
8.2	 Photolithography
8.3	 Ion Implantation
8.4	 Diffusion
8.5	 Oxidation
8.6	 Chemical Vapor Deposition
8.7	 Physical Vapor Deposition ? Sputtering
8.8	 Deposition by Epitaxy
8.9	 Etching
8.10	 Summary of Microfabrication
 Problems
Chapter 9?Overview of Micromanufacturing 
9.1	 Introduction
9.2	 Bulk Micromanufacturing
9.3	 Surface Micromachining
9.4	 The LIGA Process 
9.5	 Summary on Micromanufacturing
 Problems
Chapter 10?Microsystem Design
10.1	Introduction
 10.2	Design Considerations
 10.3	Process Design
 10.4	Mechanical Design
 10.5	Mechanical Design Using Finite Element Method
 10.6	Design of Silicon Die of a Micropressure Sensor
 10.7	Design of Microfluidics Network Systems
 10.8	Computer-Aided Design
 Problems
Chapter 11?Assembly, Packaging and Testing of Microsystems
11.1	 Introduction
11.2	 Overview of Microassembly 
11.3	 The High Costs of Microassembly 
11.4	 Microassembly Processes
11.5	 Major Technical Problems in Microassembly
11.6	 Microassembly Work Cells
11.7	 Challenging Issues in Microassembly
11.8	 Overview of Microsystems Packaging
11.9	 General Considerations in Packaging Design
11.10	 The Three Levels of Microsystems Packaging
11.11	 Interfaces in Microsystems Packaging
11.12	 Essential Packaging Technologies
11.13	 Die preparation
11.14	 Surface Bonding
11.15	 Wire bonding:
11.16	 Sealing and Encapsulation
11.17	 Three-dimensional Packaging
11.18	 Selection of Packaging Materials
11.19	 Signal Mapping and Transduction
11.20	 Design Case on Pressure Sensor Packaging
11.21	 Reliability in MEMS Packaging
11.22	 Testing for Reliability 
Problems
Chapter 12?Introduction to Nanoscale Engineering
12.1	Introduction
12.2	Micro and Nanoscale Technologies 
12.3	General Principle in Nanofabrication
12.4	Nanoproducts
12.5	Applications of Nanoproducts
12.6	Quantum Physics
12.7	Molecular Dynamics
12.8	Fluid Flow in Submicrometer and Nano Scales
12.9	Heat Conduction in Nanoscale
12.10	 Measurement of Thermal Conductivity
12.11	Challenges in Nanoscale Engineering
12.12	Social Impacts of Nanoscale Engineering 
 Problems
Bibliography
Index

Library of Congress Subject Headings for this publication:

Microelectronics.
Microelectromechanical systems.
Microelectronic packaging.