Table of contents for Thin film materials technology : sputtering of compound materials / by Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi.


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 CONTENTS
1. THIN FILM MATERIALS AND DEVICES
 1.1 THIN FILM MATERIALS
 1.2 THIN FILM DEVICES
 1.3 REFERENCES 
2 THIN FILM PROCESS 
 2.1 THIN FILM GROWTH PROCESS 
 2.1.1 Structural Consequences of the Growth Process 
 2.1.1.1 Microstructure
 2.1.1.2 Surface Roughness and Density
 2.1.1.3 Adhesion
 2.1.1.4 Metastable Structure
 2.1.2 Solubility Relaxation
 2.2 THIN FILM DEPOSITION PROCESS
2.2.1 Classification of Deposition Process
 2.2.1.1 Thermal Evaporation
 2.2.1.2 Sputtering
 2.2.1.3 Miscellaneous PVD Process
 2.2.1.4 CVD Process
2.2.2 Deposition Conditions
2.3 CHARACTERIZATION
2.4 REFERENCES 
3. SPUTTERING PHENOMENA
3.1 SPUTTER YIELD
 3.1.1 Ion energy
3.1.2 Incident Ions, Target Materials
3.1.3 Effects of Incidence Angle
3.1.4 Crystal Structure of Target
3.1.5 sputter Yields of Alloys
3.2 SPUTTER ATOMS
 3.2.1 Features of Sputtered Atoms
 3.2.2 Velocity and Mean Free Path
 3.2.2.1 Velocity of Sputtered Atoms
 3.2.2.2 Mean Free Path
3.3 MECHANISM OF SPUTTERING
 3.3.1 Sputtering Collisions
 3.3.2 Sputtering
3.4 REFERENCES
4. SPUTTERING SYSTEMS 
4.1 DISCHARGE IN A GAS
 4.1.1 Cold-Cathode Discharge
 4.1.2 Discharge in a Magnetic Field
 4.1.2.1 Spark Voltage in a Magnetic Field
 4.1.2.2 Glow Discharge in a Magnetic Field
 4.1.2.3 Glow Discharge Modes in the Transverse
 Magnetic Field
 4.1.2.4 Plasma in a Glow Discharge
4.2 SPUTTERING SYSTEM
 4.2.1 DC Diode Sputtering
 4.2.2 RF Diode Sputtering
 4.2.3 Magnetron Sputtering
 4.2.4 Ion Beam Sputtering
 4.2.5 ECR Plasma
 4.2.6 Medium Frequency Sputtering
4.3 PRACTICAL ASPECTS OF SPUTTERING SYSTEM 
 4.3.1 Target for Sputtering
 4.3.1.1 Compound Targets
 4.3.1.2 Powder Targets
 4.3.1.3 Auxiliary Cathode
 4.3.2 Sputtering Gas
 4.3.3 Thickness Distribution
 4.3.4 Substrate Temperature
 4.3.5 Off-axis Sputtering / Facing Target Sputtering
 4.3.6 Monitoring
 4.3.6.1 Gas Composition
 4.3.6.2 Sputtering Discharge
 4.3.6.3 Plasma Parameters
 4.3.6.4 Substrate Temperature Monitor
 4.3.6.5 Thickness Monitor
 4.3.6.6 Film Structure
4.4 REFERENCES
5. DEPOSITION OF COMPOUND THIN FILMS 
 5.1 OXIDES
 5.1.1 ZnO Thin Films
 5.1.1.1 Deposition of ZnO
 5.1.1.2 Electrical Properties and Applications
 5.1.2 Sillenite Thin Films
 5.1.2.1 Amorphous, Polycrystal Films
 5.1.2.2 Single Crystal Films
 5.1.3 Perovskite Dielectric Thin Films
 5.1.3.1 PbTiO3 Thin Films
 5.1.3.2 PLZT Thin Films
 5.1.4 Perovskite Superconducting Thin Films
 5.1.4.1 Studies of Thin Films Processes
 5.1.4.2 Basic Thin Film Processes
 5.1.4.3 Synthesis Temperature
 5.1.4.4 Low Temperature Process/ In Situ
 Deposition
 5.1.4.5 Deposition: Rare Earth High Tc
 Superconductors
 5.1.4.6 Deposition: Rare Earth Free High Tc
 Superconductors
 5.1.4.7 Structure and Structural Control
 5.1.4.8 Phase Control by Layer-by-Layer
 Deposition
 5.1.4.9 Diamagnetization Properties
 5.1.4.10 Passivation of Sputtered High Tc Thin 
 Films
 5.1.4.11 Multilayer and Superconductiung Devices
 5.1.5 Transparent Conducting Films
 5.2 NITRIDES
 5.2.1 TiN Thin Films
 5.2.2 Compound Nitrides Thin Films
 5.2.3 SiN Thin Films
 5.3 CARBIDES AND SILICIDES
 5.3.1 SiC Thin Films
 5.3.2 Tungsten Carbide Thin Films
 5.3.3 Mo-Si Thin Films 
 5.4 DIAMOND
 5.5 SELENIDES
5.6 AMORPHOUS THIN FILMS
 5.6.1 Amorphous ABO3
 5.6.2 Amorphous SiC
 5.7 SUPER-LATTICE STRUCTURES
 5.8 ORGANIC THIN FILMS
 5.9 MAGNETRON SPUTTERING UNDER A STRONG MAGNETIC FIELD
 5.9.1 abnormal Crystal Growth
 5.9.2 Low Temperature Doping of Foreign atoms into
 Semiconducting films
 5.10 REFERENCES
6. STRUCTURAL CONTROL OF COMPOUND THIN FILMS 
 6.1 FERROELECTRIC MATERIALS AND STRUCTURES 
 6.1.1 Ferroelectric Materials
 6.1.2 Microstructure of Heteroepitaxial Thin Films
 6.2 CONTROL OF STRUCTURE
6.2.1 Growth Temperature
 6.2.2 Buffer Layers and Graded Interface
 6.2.3 Cooing Rate
 6.2.4 Vicinal Substrates 
6.2.5 Dielectric Properties of Structure Controlled Thin Films
 6.3 NANOMETER STRUCTURES 
 6.3.1 Nanometer Materials
 6.3.2 Nanometer Superlattice
6.4 INTERFACIAL CONTROL 
6.5 REFERENCES
7. MICROFABLICATION BY SPUTTERING 
 7.1 CLASIFICATION OF SPUTTER ETCHING
7.2 ION BEAM SPUTTER ETCHING
 7.3 DIODE SPUTTER ETCHING
 7.4 DEPOSITION INTO DEEP TRENCH STRUCTURE
7.5 REFERENCES 
APPENDIX
Electric Units?Their Symbols and Conversion Factors
Fundamental Physical Constants
INDEX 
 

Library of Congress Subject Headings for this publication: Cathode sputtering (Plating process)Thin films