Publisher description for Stress-induced phenomena in metallization : Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007 / editors, Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech.
Bibliographic record and links to related information available from the Library of Congress catalog
Information from electronic data provided by the publisher. May be incomplete or contain other coding.
All papers were peer reviewed. The conference was on reliability related science in ULSI interconnect, and the main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips.
Library of Congress subject headings for this publication:
Interconnects (Integrated circuit technology) -- Defects -- Congresses.
Metal-metal bonds -- Congresses.
Strength of materials -- Congresses.
Nanostructured materials -- Congresses.
Semiconductors -- Congresses.
Copper -- Electric properties -- Congresses.