Table of contents for Introduction to microsystem technology : a guide for students / Gerald Gerlach, Wolfram Dotzel ; translated by Dorte Muller.


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Table of contents

Preface
1 Introduction

1.1 What is a microsystem?

1.2 Microelectronics and microsystem technology

1.3 Areas of application and trends of development

1.4 Example: Yaw rate sensor

2 Scaling and Similarity

2.1 Scaling

2.2 Similarity and dimensionless numbers
3 Materials

3.1 Overview

3.2 Single crystalline silicon

3.3 Glasses

3.4 Polymers

3.5 Thin films

3.6 Comparison of material characteristics

4 Microfabrication

4.1 Overview

4.2 Cleanliness during production

4.3 Lithography

4.4 Thin-film formation

4.5 Layer patterning

4.6 Anisotropic Wet Chemical Deep Etching

4.7 Doping

4.8 Bonding techniques

4.9 Insulation techniques

4.10 Surface micromachining

4.11 Near-surface micromachining

4.12 HARMST

4.13 Miniaturized classical techniques

4.14 Selection of microtechnical manufacturing techniques

5 Packaging

5.1 Tasks and requirements

5.2 Functions of packaging

6 Function and Form Elements in Microsystem Technology

6.1 Mechanical elements

6.2 Fluidic elements

6.3 Thermal elements

7 Sensors and actuators

7.1 Reversible and parametric transducers

7.2 Transducers for sensors and actuators

8 Design of microsystems

8.1 Design methods and tools

8.3 Systems with distributed parameters

9 Effect of technological processes on microsystem properties

9.1 Parameter-based microsystem design

9.2 Robust microsystem design

10 The Future of Microsystems

10.1 Status and trends in microsystem technology

10.2 Microoptical Applications

10.3 Probe Tips

10.4 RF Microsystems

10.5 Actuators

10.6 Microfluidic systems
10.7 Chemical, Biological, and Medical Systems

10.8 Energy Harvesting and wireless communications

10.9 Micro fuel cells
Appendix A Physical constants

Appendix B Coordinate transformation

B.1 Elastic coefficients

B.2 Piezoresistive coefficients

Appendix C Properties of silicon dioxide and silicon nitride layers

Appendix D Nomenclature of thin-layer processes

Appendix E Adhesion of surface micromechanical structures

E.1 Capillary forces

E.2 Critical length of cantilever springs
List of symbols
List of abbreviations





Library of Congress subject headings for this publication:
Microelectromechanical systems -- Design and construction.
System design.
Microelectronics.