Publisher description for Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.


Bibliographic record and links to related information available from the Library of Congress catalog


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Counter State-of-the-art introduction to high-density interconnect technology

The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that;s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee;s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

Library of Congress subject headings for this publication: Microelectronic packaging, Integrated circuits Design and construction Cost control, Semiconductors Junctions, Printed circuits