Publisher supplied contributor biographical information for Fundamentals of microsystems packaging / Rao R. Tummala, editor.
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Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
Library of Congress subject headings for this publication: Electronic packaging Handbooks, manuals, etc, Microelectronic packaging Handbooks, manuals, etc, Miniature electronic equipment Packaging Handbooks, manuals, etc