Publisher supplied contributor biographical information for Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

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Counter John H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the University of Hong Kong.

Library of Congress subject headings for this publication: Microelectronic packaging, Integrated circuits Design and construction Cost control, Semiconductors Junctions, Printed circuits