Publisher supplied contributor biographical information for Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.
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Biographical text provided by the publisher (may be incomplete or contain other coding). The Library of Congress makes no claims as to the accuracy of the information provided, and will not maintain or otherwise edit/update the information supplied by the publisher.
John H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world.
Ricky S. Lee (Hong Kong, China) is a Professor
of Electrical Engineering at the University of Hong Kong.
Library of Congress subject headings for this publication: Microelectronic packaging, Integrated circuits Design and construction Cost control, Semiconductors Junctions, Printed circuits